Note: Pin numbering follows JEDEC standards. The "A1" ball is indicated by a chamfered corner on the package top. View is from TOP (ball side down, looking through the package). | Pin(s) | Symbol | Description | Importance | | :--- | :--- | :--- | :--- | | A2, A3, A4, B1, B2, B3, B4, C1, C2, C3, C4 | VCC | NAND Core Supply – 2.5V to 3.6V (typically 3.3V). Supplies power to the NAND flash array. High current draw during writes. | Critical | | D1, D2, D3, E1, E2, E3, F1, F2, F3, G1, G2, G3, G4 | VCCQ | Controller & I/O Supply – 1.14V to 1.26V (typically 1.2V) or 1.8V. Powers the UFS controller core and M-PHY. | Critical | | A1, K4, L4, M4, N1, N2, N3, N4, N5, N6, N7... | VSS | Ground. All VSS balls must be connected to a solid ground plane. | Critical | | H4, J4 | VCCQ2 | Optional second I/O supply for legacy compatibility. Usually tied to VCCQ. | Low | Table 2: High-Speed M-PHY Differential Pairs (The “Data” Pins) UFS 3.1 supports up to two lanes. Lane 0 is mandatory; Lane 1 is optional but required for maximum performance.
| Signal Group | Pin (Lane 0) | Pin (Lane 1) | Description | Differential Impedance | | :--- | :--- | :--- | :--- | :--- | | | R1 (DOUT_T0_P) R2 (DOUT_T0_M) | M1 (DOUT_T1_P) M2 (DOUT_T1_M) | Device Transmit to Host. Positive (P) and Negative (M) diff pair. | 100Ω ±10% | | RX (Host to Device) | T2 (DIN_T0_P) T3 (DIN_T0_M) | P1 (DIN_T1_P) P2 (DIN_T1_M) | Device Receive from Host. Positive and Negative diff pair. | 100Ω ±10% | | REF_CLK | K1 (REF_CLK_P) K2 (REF_CLK_N) | N/A | Differential reference clock (19.2 MHz, 26 MHz, or 38.4 MHz) from host. | 100Ω | ufs 3.1 pinout
For hardware engineers, PCB designers, and data recovery technicians, understanding the is not just a theoretical exercise; it is a practical necessity. Whether you are designing a next-generation device, troubleshooting a dead phone, or attempting direct memory access for forensic analysis, the 153-ball BGA (Ball Grid Array) pinout is your roadmap. Note: Pin numbering follows JEDEC standards
Introduction: The Need for Speed in Mobile Storage The Universal Flash Storage (UFS) standard has rapidly become the backbone of high-performance mobile computing. From flagship smartphones like the Samsung Galaxy S23 to automotive infotainment systems and professional drones, UFS 3.1 offers sequential read speeds exceeding 2,100 MB/s—dwarfing the capabilities of eMMC. | Pin(s) | Symbol | Description | Importance
This article provides an exhaustive breakdown of the UFS 3.1 pinout, covering signal groups, voltage domains, layout guidelines, and probing techniques. Before dissecting the pinout, it is crucial to understand the internal architecture of a UFS 3.1 chip.