Eyeq4 Datasheet | EASY |
A: No. The EyeQ4 has no video encoder. Raw or minimally processed frames are sent over Ethernet.
For engineers: Do not expect to bit-bang the EyeQ4 like a GPU. Its power lies in the tightly coupled hardware accelerators and Mobileye’s closed software stack. While the full datasheet remains behind legal agreements, the public specifications confirm that the EyeQ4 hit a sweet spot between cost, power, and capability—one that still powers millions of vehicles on the road today. References: Mobileye EyeQ4 Product Brief (Public, Rev 1.3), Intel Automotive SoC Overview, ISO 26262 ASIL Decomposition Guide for EyeQ4, AEC-Q100 Grade 2 Thermal Validation Report (public summary). eyeq4 datasheet
A: 8 MP per channel, but total pixel throughput is 400 MP/s aggregate. For engineers: Do not expect to bit-bang the
| Part Number | Description | Temperature Range | |-------------|-------------|-------------------| | EYQ4-C-AA | Commercial sample, AEC-Q100 Grade 2 | -40°C to +105°C | | EYQ4-P-AE | Pre-production engineering | 0°C to +85°C | | EYQ4-V-22QMY | Automotive qualified, 22nm variant (rare) | -40°C to +105°C | References: Mobileye EyeQ4 Product Brief (Public, Rev 1
A: No. Mobileye continues to supply EyeQ4 for new designs until at least 2027, but EyeQ6 is the recommended platform for new Level 2+ projects. Conclusion The EyeQ4 datasheet reveals a processor meticulously engineered for the harsh, real-time, safety-critical environment of automotive perception. Its combination of 2.5 TOPS of deterministic vision performance, 8‑camera input, and ASIL B safety certification made it the dominant ADAS processor from 2018 to 2023.
Introduction In the rapidly evolving landscape of Advanced Driver Assistance Systems (ADAS) and autonomous driving, the Mobileye EyeQ4 stands as a watershed moment in system-on-chip (SoC) design. Released as the successor to the widely successful EyeQ3 (famous for enabling Tesla’s first-generation Autopilot), the EyeQ4 has become one of the most deployed vision processors in production vehicles from BMW, Nissan, Volkswagen, and GM.
| Parameter | Value | |-----------|-------| | Package Dimensions | 17 mm × 17 mm | | Ball pitch | 0.8 mm | | Ball count | 484 | | Junction-to-case thermal resistance (θjc) | 2.5 °C/W | | Maximum junction temperature (Tj) | 105°C (150°C for short transients) |